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        1. App.:Communication Electronics

          Thickness:1.0mm

          Surface treatment:ENIG+OSP

          Material:FR4 TG150

          Layer:8L HDI(2+4+2)

          Location:INDEX > TECHNICAL > Technology Roadmap
              2016 2017
          1 Product Catagory HDI ELIC(4+2+4) HDI ELIC(5+2+5)
          2 Max. Layer Count 30L 32
          3 Board Thickness Core thckness:0.05mm-1.5mm
          Finished board thivkness:0.3mm-3.5mm
          Core thckness:0.05mm-1.5mm
          Finished board thivkness:0.3mm-3.5mm
          4 Min. Hole Size Laser:0.1mm/4mil Mechnical:0.15mm/6mil Laser:0.075mm/3mil Mechnical:0.15mm/6mil
          5 Min. Lind Width/Space 0.035mm/0.035mm(1.4mil/1.4mil) 0.030mm/0.030mm(1.2mil/1.2mil)
          6 Copper Thickness 1/3OZ-2OZ 1/2OZ-5OZ
          7 Max. Panel Size 700mm*610mm 700mm*610mm
          8 Registration Accurary +/-0.05mm(2mil) +/-0.05mm(2mil)
          9 Routing Accuracy +/-0.10mm(4mil) +/-0.075mm(3mil)
          10 Min. BGA PAD 0.20mm(8mil) 0.15mm(8mil)
          11 Max. Aspect Ratio 8:1 10:1
          12 Bow and Twist 0.50% 0.50%
          13 Impedance Control Tolerance +/-8% +/-8%
          14 Daily Output 2000m2 3000m2
          15 Surface Finishing ENIG/OSP/HASL/FINGER GOLD/IMMERSION TIN ENIG/OSP/HASL/FINGER GOLD/IMMERSION TIN
          16 Raw Material FR4/NORMAL Tg/HIGH Tg/Low Dk/HF FR4/PTFE/PI FR4/NORMAL Tg/HIGH Tg/Low Dk/HF FR4/PTFE/PI
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